COURSE OUTLINE
PHYSICS OF FAILURE IN ELECTRONIC SYSTEMS
- Program Objective
- Areas That Require Analysis And Evaluation
- Environmentally Induced Failures
- Reliability Perspectives, MTBF Versus Effective Operating Life
- How Thermal Cycling Environments Affect Fatigue Life
- Effects Of Thermal Expansion
- Sine And Random Vibration Characteristics
- Estimating The Fatigue Life Of Surface Mounted Devices
- Combining Fatigue Damage From Many Different Environments
- Sample Problems
MOUNTING METHODS FOR VARIOUS TYPES OF ELECTRONIC COMPONENTS
- Different Types Of Electronic Components And PCB Mountings
- Techniques For Attaching Surface Mounted And Through-Hole Devices To PCBs And Their Associated Problems
- Mounting Components That Have Bottom Lead Wires
- Problems With Mounting Small Axial Leaded Components
- Areas Where Minor Structural Changes Can Produce Large Increases In Fatigue Life
- Tips To Improve Heat Dissipation
THERMAL CYCLE CREEP AND FATIGUE FAILURES IN LEAD WIRES AND SOLDER
- Solder Thermal Cycle And Vibration S-N Fatigue Curves
- Solder Strain Fatigue Life Plots
- Solder Creep With Constant Stress And With Constant Displacement
- Solder Creep And Stress Relaxation
- Solder Creep Stress Relaxation As A Function Of Time
- Thermal Cycle Fatigue Life Test Data On Different Types Of Surface Mounted And Through-Hole Mounted Components
X-Y THERMAL EXPANSION DISPLACEMENTS AND STRESSES IN BOTTOM LEADED COMPONENTS
- Sample Problem: Methods For Reducing Forces And Stresses In The Lead Wires And Solder Joints Of A Hybrid
- Sample Problem: Shear Tear-Out Stress In A Through-Hole Solder Joint
- Thermal Cycling Crowbar Effects In DIP Lead Wires
THERMAL CYCLING AND VIBRATION FATIGUE IN ELECTRONICS STRUCTURES
- Effects Of Fatigue And Damage In Electronic Structures
- Problem Areas In Predicting Vibration Fatigue Life Of Electronic Components
- Comparing Vibration Test Data Failures With Finite Element Computer Analysis Data
- Vibration Test Set Up With An Electrodynamic Shaker
- Typical Failure Locations In DIP Lead Wires And Solder Joints
- COMBINING THERMAL CYCLING AND VIBRATION FATIGUE DAMAGE
- Alternating Stress Superimposed Upon A Steady Stress
- Vibration Test Data Failures In Pin Grid Array Wires At Low Temperatures
- Combining Thermal Cycling And Vibration Damage
- Miner's Combined Cumulative Fatigue Damage Criteria
- Integrity Driving Geometric Factors That Influence Fatigue Life
- Tension, Torsion And Bending Stresses In 40-Pin DIP Wires
COMBINING THERMAL CYCLING AND VIBRATION FATIGUE DAMAGE
- Alternating Stress Superimposed Upon A Steady Stress
- Vibration Test Data Failures In Pin Grid Array Wires At Low Temperatures
- Combining Thermal Cycling And Vibration Damage
- Miner's Combined Cumulative Fatigue Damage Criteria
- Integrity Driving Geometric Factors That Influence Fatigue Life
- Tension, Torsion And Bending Stresses In 40-Pin DIP Wires
DISPLACEMENTS, FORCES AND STRESSES IN AXIAL LEADED COMPONENT WIRE FRAMES DUE TO X-Y THERMAL EXPANSIONS
- Thermal Expansion Model
- Use Of Superposition Method
- Application Of Castigliano's Strain Energy Theorem
- Samples Of Spread Sheets For Lead Wire Forces And Stresses
- Samples Problems To Illustrate Methods For Reducing Forces And Stresses
THERMAL CYCLING STRESS FAILURES IN SURFACE MOUNTED COMPONENTS
- Solder Shear Strain In Surface Mounted Components
- The U.S. Air Force Avionics Integrity Program To Improve The Reliability Of Electronic Equipment
- Predicting The Approximate Fatigue Life In Electronic Assemblies
- Accelerated Life Testing Methods
- Thermal Cycling Tests
- Ceramic Chip Carrier And Plastic Chip Carrier Components
- Cumulative Damacre Concepts For Estimating The Fatigue Life
- Sample Problems
VIBRATION AND NATURAL FREQUENCIES OF SIMPLE ELECTRONIC STRUCTURES
- Sample Problems To Illustrate Different Modes Of Resonant Frequencies
- Desired PCB Resonant Frequency For A 10 Million Cycle Fatigue Life
- The Most Important Relation In Dynamics
- How The Component Location And Orientation On A PCB Affect The Fatigue Life
- Test Data Of PCBs And Electronic Boxes
- Case History Of A Failed Die Bond Wire Inside A Hybrid
RELATIVE DYNAMIC DISPLACEMENT BETWEEN THE COMPONENT AND THE PCB PRODUCING STRAIN IN THE LEAD WIRES
- Derivation Of The Displacement Equation
- Sample Problem To Determine The Relative Displacement Between The DIP And The PCB
- Application Of Castigliano's Strain Energy Theorem To Derive The Lead Wire Stiffness With A Small Kink And Compare With Results Of Finite Element Analysis
- Estimation Of Fatigue Life
VIBRATION AND THERMAL STRESSES IN THE LEAD WIRES AND SOLDER JOINTS OF A TRANSISTOR MOUNTED ON A PCB
- Fatigue Life Dynamic Analysis
- Derivation Of Thermal Expansion Equilibrium Equations
- Analysis Of The Tensile Stresses, Shear Stresses And Fatigue Life
- Sample Problem To Study Failure During Sinusoidal Vibration
FINITE ELEMENT MODELING METHODS, TECHNIQUES AND PROBLEMS
- Finite Element Methods (FEM) For Accurate Prediction Of Resonant Frequencies, Forces And Stresses
- Discussions Of Different FEMs
- Various FEMs Of Different Types Of Solder Joints
- Finite Element Model Showing Stresses In DIP Lead Wires
CASE HISTORIES OF FAILURES AND FAILURE ANALYSIS
- Failures Of Small Ceramic Chip Resistors And Capacitors
- Failures In Small Axial Leaded Through-Hole Components
- Surface Mounted Transformer Lead Wire Failures
- Microprocessor Lead Wire Solder Joint Failures
- Relay Vibration Failures And Possible Screening Methods
- Hybrid Shock Failure Of Internal Die Bond Wires
- Cracked Casting Failure Analysis
- Failure Analysis Of A Small Shaft
CONNECTOR WEAR AND FRETTING CORROSION
- Connector Materials And Protective Coatings
- Visual Inspection Of Failed Connector Pins
- Non-Destructive Chemical Test
- Connector Contact Resistance Test Set Up
- Connector Contact Vibration Test Set Up
- Test Data Of Different Connector Wear Curves