|
|
|
Seminar 14.
Preventing Thermal Cycling & Vibration Failures |
|||
|
The purpose of the course is to develop simple design rules and guidelines which will insure the desired fatigue life of solder joints, lead wires, connectors, surface mounted and through-hole types of components, PCBs, cables. Harnesses and enclosures. Click here for a complete, printable, class description. Click here to access Mr. Steinberg's other classes: Cooling Techniques for Electronic Equipment Preventing Vibration & Shock Failures in Electronic Equipment |