by Mr. Jean-Paul Clech, Ph.D.

This seminar provides an extensive coverage of lead-free attachment reliability issues and trends and offers practical guidelines to assess the reliability of lead-free solder joints and circuit board assemblies. An in-depth understanding of the multitude of material, design and manufacturing parameters that affect solder joint reliability is critical to the deployment of lead-free circuit board assemblies. Following a review of the basics of solder joint mechanics, test procedures, failure modes and mechanisms, the seminar puts in perspective a wide range of lead-free data, material properties, test and modeling results from across the industry. Accelerated test results are discussed for common components (leadless, leaded, BGA, Flip-Chip, CSPs), including the effect of board and component finish on lead-free reliability, and a comparison of tin-lead, mixed assemblies and lead-free reliability data. Metallurgical risks, creep properties and fatigue curves are examined that explain differences in the reliability of tin-lead and lead-free assemblies. Life prediction models and acceleration factors are presented, comparing test efficiency for lead-free and tin-lead assemblies and illustrating how to extrapolate lead-free test results to field use conditions.

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