1) Description and validation of Solder Reliability Solutions (SRS) life
prediction model: 3 papers
a. SMI 1996 paper (details of the model - .pdf 0.16mb)

b. SMI 1998 paper (application of the model to flip-chip and CSP assemblies - .pdf 0.12mb)

c. SMT Nuremberg 2000 paper (additional model validation for BGA, flip-chip and CSP assemblies - .pdf 0.07mB)

2) Detailed application notes (SRS model) with input data and test results:
a. CBGA and LCCC components - (.pdf 0.06mb)

b. SuperBGA type components - (.pdf 0.3mb)

c. PQFP components - (.pdf 0.06mb)