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PREVENTING THERMAL CYCLING AND VIBRATION FAILURES
by Steve Carlson
The purpose of the course is to develop simple design rules and guidelines which will insure the desired fatigue life of solder joints, lead wires, connectors, surface mounted and through-hole types of components, PCBs, cables. Harnesses and enclosures.
OBJECTIVES
To understand how variations in thermal coefficients of expansion (TCE) can affect the magnitude of the displacements, forces, and stresses that are developed in electronic assemblies during thermal cycling environments.
To understand how resonant conditions can affect dynamic displacements, forces and stresses in electronic assemblies during different sine vibration, random vibration and environments.
To understand the concept of "damage accumulation" and how it can be used to determine the approximate fatigue life of various electronic assemblies due to different combinations of fatigue accumulated in thermal cycling, vibration and shock environment.
WHO SHOULD ATTEND
Designers, engineers and managers from all the following functions:
Quality Assurance
Reliability
Test Engineer
Research & Development
Product Design
Production & Manufacturing
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