OBJECTIVE

This course offers an introductory understanding of some of the key engineering accelerated test techniques needed to develop reliable electronic products. Participants are presented with various physics of failure methods to provide design and test for reliability.

Participants Will . . .

• Learn how products really fail and understand key reliability issues.
• Become acquainted with the failure modes and mechanisms associated with various electronic devices and assemblies.
• Determine the stresses associated with the assessment of reliable electronic equipment and examine techniques to address problems of reliability.
• Investigate the usage and applicability of reliability standards and handbooks.

WHO SHOULD ATTEND

This course is intended for those who are involved in the design, analysis, material selection, manufacture and test of microelectronic components, printed circuit/wiring boards and assemblies. Participants will receive an understanding of the various reliability tradeoffs in electronic packaging.

COURSE OUTLINE

Why Do Electronics Really Fail?

Do the Old Standards Do the Job?

The Physics of Failure Approach

• Stress Analysis Approaches
• Failure Models
• Case Studies
  • Ball Grid Array Interconnect Reliability
  • Vias and PTHs
  • Conductive Filament Formation
  • Wire Bond Failures in Glob-Top Chip-On-Board Packages

PoF Approach for Accelerated Qualification

• The 5-Step Approach for Accelerated Life Testing
• Virtual Qualification and Stress Margins
• Acceleration Transforms
• Testing and Data Post-Processing
• Case Studies:
  • Combined Thermal Cycling and Vibration
  • Vibration and Mechanical Shock
  • Combined Thermal Cycling and Vibration
  • Combined Temperature and Humidity

The PoF Approach for Process Verification Testing

• Types of Screens:
  • Non-Destructive Screens
  • Proof Tests
  • Accelerated Wearout Screens
• The two-step approach for Screening

Summary