LEAD-FREE SOLDER JOINT RELIABILITY

by Mr. Jean-Paul Clech, Ph.D.

This seminar provides an extensive coverage of lead-free attachment reliability issues and trends and offers practical guidelines to assess the reliability of lead-free solder joints and circuit board assemblies. An in-depth understanding of the multitude of material, design and manufacturing parameters that affect solder joint reliability is critical to the deployment of lead-free circuit board assemblies. Following a review of the basics of solder joint mechanics, test procedures, failure modes and mechanisms, the seminar puts in perspective a wide range of lead-free data, material properties, test and modeling results from across the industry. Accelerated test results are discussed for common components (leadless, leaded, BGA, Flip-Chip, CSPs), including the effect of board and component finish on lead-free reliability, and a comparison of tin-lead, mixed assemblies and lead-free reliability data. Metallurgical risks, creep properties and fatigue curves are examined that explain differences in the reliability of tin-lead and lead-free assemblies. Life prediction models and acceleration factors are presented, comparing test efficiency for lead-free and tin-lead assemblies and illustrating how to extrapolate lead-free test results to field use conditions.
CLASSES ON RELIABILITY
Length Course Title Instructor
2 days 1. Introduction to Reliability & Weibull Analysis Chet Haibel, M.S.E.E.
2 days 2. HALT & HASS + Workshop Larry Edson, BSME, CQE
3 days 4. Demonstrating Reliability with Accel. Testing Larry Edson, BSME, CQE
4 days 6. Accelerated Test Data Analysis Wayne Nelson, Ph.D.
SPECIFIC TECHNICAL CLASSES
Length Course Title Instructor
2 days 7. Physics of Failure Mr. Abhijit Dasgupta, Ph.D.
2 days 8. Lead-Free Solder Joint Reliability Jean-Paul Clech, Ph.D.
1 day 9. Medical Device Risk Management Chet Haibel, M.S.E.E.
2 days 10. Preventing Thermal & Vibe Failures Larry Edson, BSME, CQE
CUSTOM SEMINARS OFFERED
Length Course Title Instructor
1 day 12. Integrating Adv. Quality, Reliability, Durability
(QRD) Tactics with Accelerated Product Dev.		 James G. McLeish, M.S.
3 days 13. HALT & HASS and Classical Rel. Methods Integrated Edson / Haibel
2 days 14. Preventing Vibration & Shock Failures Prof. Dave Steinberg, P.E.
2 days 15. Preventing Thermal Cycling & Vibrration Failures Prof. Dave Steinberg, P.E.
2 days 16. Cooling Techniques for Electronic Equipment Prof. Dave Steinberg, P.E.


WHO SHOULD ATTEND
Design, materials, manufacturing, quality or reliability professionals and managers who are responsible for, or plan to implement lead-free assembly technologies in their companies and products.

Click here for a complete, printable, class description.
CLASS REGISTRATION
Check Mailed
Payment at Seminar
Visa or Mastercard
(for your security, please fax or phone your credit card information after registering)

Seminars fees for North America:
1 day - $695;
2 days - $1195; 3 days - $1595.
Click here for the long Registration Form
Contacts:
Hobbs Engineering Corp.
4300 West 100th Ave,
Westminster, CO 80031
Tel: 303-465-5988
Fax: 303-469-4353
learn@hobbsengr.com

©2008 Hobbs Engineering Corp.