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LEAD-FREE SOLDER JOINT RELIABILITY
by Mr. Jean-Paul Clech, Ph.D.
This seminar provides an extensive coverage of lead-free attachment reliability issues and trends and offers practical guidelines to assess the reliability of lead-free solder joints and circuit board assemblies. An in-depth understanding of the multitude of material, design and manufacturing parameters that affect solder joint reliability is critical to the deployment of lead-free circuit board assemblies. Following a review of the basics of solder joint mechanics, test procedures, failure modes and mechanisms, the seminar puts in perspective a wide range of lead-free data, material properties, test and modeling results from across the industry. Accelerated test results are discussed for common components (leadless, leaded, BGA, Flip-Chip, CSPs), including the effect of board and component finish on lead-free reliability, and a comparison of tin-lead, mixed assemblies and lead-free reliability data. Metallurgical risks, creep properties and fatigue curves are examined that explain differences in the reliability of tin-lead and lead-free assemblies. Life prediction models and acceleration factors are presented, comparing test efficiency for lead-free and tin-lead assemblies and illustrating how to extrapolate lead-free test results to field use conditions.
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| NEW SEMINARS AND WEBINARS |
| Length |
Course Title |
Instructor |
| 1 day |
17. Ensuring Reliability in Lean Product Development |
John Paschkewitz |
| 1 day |
18. Advancing HALT & HASS:
Moving to Comparative Limit Anaylsis |
Kirk Gray |
| 3 hours |
19. How to Effectively Implement DFR & DFSS
in a Systems Engineering Environment |
Thimmiah Gurunatha, Peng. |
| 3 hours |
20. Thunder & Lightning Accelerated Testing
in a Systems Engineering Environment |
Thimmiah Gurunatha, Peng. |
| 3 hours |
Gage R & R or Measuring Systems Analysis |
Thimmiah Gurunatha, Peng. |
| 3 hours |
Rainbow SPC |
Thimmiah Gurunatha, Peng. |
| 3 hours |
Improving Test Effect. and Effic. using Orthogonal Arrays |
Thimmiah Gurunatha, Peng. |
| 3 hours |
Design for Six Sigma Tools to Promote the Development of World Class Product Requirements |
Sam Keene |
| 3 hours |
21. Quickest Way to Reliability is to
HALT and go FISHing |
Howard Cooper, DFSS BB, DFR |
| 2 hours |
22. Understanding Shock and Vibration |
Alec Feinberg, Ph.D. |
| 3 hours |
Physics of Failure Methods for Building-in Reliability into Products |
Abhijit Dasgupta, Ph.D. |
| 3 hours |
24. Intro to Design for Manufacturability |
Aldo Fucinari |
| 3 hours |
25. Microelectronic Pkg Issues and Failure Analysis |
Tom Green |
| CLASSES ON RELIABILITY |
| Length |
Course Title |
Instructor |
| 2 days |
1. Introduction to Reliability & Weibull Analysis |
Chet Haibel, M.S.E.E. |
| 2 days |
2. HALT & HASS + Workshop |
Kirk Gray |
| 2 days |
2. HALT & HASS + Workshop |
Chet Haibel |
| 2 days |
2a. Mastering HALT & HASS |
Kirk Gray |
| 2 days |
2a. Mastering HALT & HASS |
Chet Haibel |
| 2 days |
4. Demonstrating Reliability |
Chet Haibel |
| 4 days |
6. Accelerated Test Data Analysis |
Wayne Nelson, Ph.D. |
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| SPECIFIC TECHNICAL CLASSES |
| Length |
Course Title |
Instructor |
| 2 days |
7. Physics of Failure |
Abhijit Dasgupta, Ph.D. |
| 2 days |
8. Lead-Free Solder Joint Reliability |
Jean-Paul Clech, Ph.D. |
| 1 day |
9. Medical Device Risk Management |
Chet Haibel, M.S.E.E. |
| 2 days |
14. Cooling Techniques for Electronic Equipment |
Steve Carlson |
| 2 days |
15. Preventing Shock and Vibration Failures |
Steve Carlson |
| 2 days |
16. Preventing Thermal & Vibration Failures |
Steve Carlson |
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| CUSTOM SEMINARS OFFERED |
| Length |
Course Title |
Instructor |
| 1 day |
12. Integrating Adv. Quality, Reliability, Durability
(QRD) Tactics with Accelerated Product Dev. |
James G. McLeish, M.S. |
| 3 days |
13. HALT & HASS and Classical Rel. Methods Integrated |
Chet Haibel, M.S.E.E. |
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WHO SHOULD ATTEND
Design, materials, manufacturing, quality or reliability professionals and managers who are responsible for, or plan to implement lead-free assembly technologies in their companies and products.
Click here for a complete, printable, class description.

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