Jean-Paul Clech, Ph.D.

Dr. Jean-Paul Clech has over 20 years of practical experience in SMT design, soldering quality and reliability assurance. He maintains one of the largest databases of solder joint reliability data, material properties and life prediction models in the industry and is constantly challenged by problems brought about by new and emerging technologies. His current research interests are in BGA, CSP, flip-chip and lead-free assembly reliability, including the development of lead-free solder acceleration factors and life prediction models.

Jean-Paul is the founder of EPSI Inc. in Montclair, NJ. His responsibilities include technical consultation and problem solving for clients across the electronics industry worldwide, and the development of engineering tools and training programs to prevent or solve reliability problems in electronic packages and board assemblies. He is the principal developer of the "Solder Reliability Solutions" model and application software. He has also served as an expert-witness in product litigations involving solder joint field failures.

Jean-Paul previously was Manager of Electronic Packaging at a European super-computer start-up, a Member of the Technical Staff and then consultant at AT&T Bell Laboratories. He received the Diplôme d' Ingénieur from Ecole Centrale de Paris, France (Materials Science major), and the M.S. and Ph.D. degrees in Mechanical Engineering from Northwestern University, Evanston, IL. His technical interests include thermal, mechanical, structural and fatigue behavior of electronic materials, packages and assemblies, and the application of engineering principles to the physical design and manufacturing of electronic systems. He is the author of over forty technical papers, a frequent speaker at technical conferences, and has been an invited lecturer and instructor at various corporate events and professional venues in Asia, Europe and North America. He is an active member of ASME, IEEE, IMAPS, TMS and SMTA. In 2003, Jean-Paul received the SMTA Member of Distinction award.

Click here for a summary of his new class, Lead-Free Solder Joint Reliability

Published Papers
CLASSES ON RELIABILITY QUICK REGISTRATION
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Seminars fees for North America:
1 day - $695; 2 days - $1195; 4 days - $1695
Click here for Standard Registration Form
2 days Practical Reliability Engineering Chet Haibel, M.S.E.E.
2 days HALT & HASS + Workshop Gregg Hobbs, Ph.D., P.E.
2 days Demonstrating Reliability with Accel. Testing Larry Edson, BSME, CQE
1 day Advanced Applications in Accelerated Testing Larry Edson, BSME, CQE
4 days Accelerated Test Data Analysis Wayne Nelson, Ph.D.
SPECIFIC TECHNICAL CLASSES
2 days Physics of Failure Mr. Abhijit Dasgupta, Ph.D.
2 days Lead-Free Solder Joint Reliability Jean-Paul Clech, Ph.D.
2 days Preventing Vibration & Shock Failures Prof. Dave Steinberg, P.E.
2 days Preventing Thermal Cycling & Vibr. Failures Prof. Dave Steinberg, P.E.
2 days Cooling Techniques for Electronic Equip. Prof. Dave Steinberg, P.E.
CUSTOM SEMINARS OFFERED
1 day Integrating Adv. Quality, Reliability, Durability
(QRD) Tactics with Accelerated Product Dev.		 James G. McLeish, M.S.
3 days HALT & HASS and Classical Rel. Methods Integrated Hobbs / Haibel