COURSE DESCRIPTION
Don't wait until your electronic equipment over-heats or fails because of poor cooling. Find out if your present systems are adequately cooled, how to avoid many common cooling problems and how to design efficient, reliable cooling systems for many different types of electronic cabinets.
The purpose of this course is to show designers and engineers quick methods for designing electronic equipment to withstand severe thermal environments without failing. Techniques are presented which will permit the evaluation and design of cost effective, compact cooling systems, without the aid of a large digital computer.
Learn simple design rules, and guidelines, which can improve the effective cooling of your sophisticated electronic components used in today's military, industrial and commercial electronic systems. Examine real hardware samples, which demonstrate the state-of-the-art techniques for packaging modern electronic equipment.
Learn methods for determining thermal stresses in lead wires and solder joints due to a mismatch in thermal expansions.
This course is based upon the popular cooling seminars Mr. Steinberg has been presenting overseas, at many private companies, and at the University of Wisconsin -Extension for the past ten years.
Questions are encouraged during the course, to make sure each participant understands the design techniques and applications presented.
WHO SHOULD ATTEND
Designers, engineers and managers from all the following functions:
WHAT YOU WILL LEARN
- How To Avoid Many Common Cooling Problems
- How To Check If Your Present Electronic Systems Are Adequately Cooled
- Quick Methods For Designing To Withstand Severe Thermal Environments
- How To Tell The Difference Between Vibration Induced Failures And Thermally Induced Failures
- The State-of-the-Art Techniques For Packaging Modern Electronic Equipment, From Real Hardware Examples
COURSE OUTLINE
Various Types of Electronic Enclosures
- Various Types of Electronic Enclosures
- Sheet Metal Assemblies
- Dip Brazed Chassis With Convoluted Fin Heat Exchanger
- Investment Cast Chassis With Pin Fin Heat Exchanger
- Numerical Control Milling For Electronic Boxes
- Die Cast Small Electronic Enclosures
- Screw And Glue Electronic Boxes
- Humidity And Moisture Drain Hole Requirements
- RFI And EMI Problems With Some Types Of Boxes
- Sealed Electronic Boxes, Good And Bad
Mounting Various Types Of Components On Circuit Boards
- Problems With Surface Mounting Leadless Chip Carriers
- Adding Thermal Compression Bonded J Leads To Chips
- Vapor Phased Soldering S Wires To Surface Mounted Parts
- Problems With Surface Mounting Transformers
- Avoiding Cracking of Chip Resistors and Capacitors
- Surface Mounting Ball Grid Arrays
- Surface Mounting Large Multi Chip Modules
- Surface Mounting Large Fine Pitch Leaded Components
- Problems With Through Hole Mounting Pin Grid Arrays
- Problems With Through Hole Mounting Small Axial Leaded Resistors
- Various Types Of Lead Wire Strain Relief To Prevent Solder Failures
- Avoid Flush Mounting On Through Hole Components
- Case Histories o Successes and Failures
Effective Natural Convection And Radiation Cooling
- Adding External Fins on a Box To Improve Cooling
- Cooling Vertically Oriented Circuit Boards
- Cooling Horizontally Oriented Circuit Boards
- Making Effective Use Of Extruded Fin Heat Sinks
- Methods For Increasing Convection And Radiation Coefficients
- Combining Convection And Radiation Cooling
- Effects of Solar Energy on Outdoor Electronics
- Solar Radiation and Albedo Effects
- Cooling for Orbiting Satellites
- Adding Cooling Fins on Hot Components
- Natural Cooling Methods for Enclosed Box
- Required Spacing Between Circuit Boards for Good Cooling
- How Altitude Effects Natural Convection Cooling
- Many Sample Problems To Demonstrate Practical Applications
Methods For Improving Forced Convection Cooling
- Various Types of A/C and D/C Cooling Fans
- Typical Problems with Improper Fan Installation
- How To Determine and Cure Short Circuit Cooling Air Flow Path
- Air Flow Properties of Fans and Blowers
- Calculating Pressure Drops Through A Chassis
- Matching the Impedance Curves for Chassis and Fan
- Understanding Static, Velocity and Total Pressure
- Flow Losses Due to Entrance, Exit, Expansion and Turns
- Cooling Air Flow from an Environmental Control System
- Effects of Altitude on Mass Flow and Pressure Drop
- Working with Sigma Delta Pressure Drop
- Convoluted Fin and Pin Fin Heat Exchanger Performance
- Many Sample Problems to Illustrate Cost Effective Applications
Practical Conduction Cooling Design Guidelines
- Concentrated and Uniform Heat Load Temperature Rise
- One and Two Dimensional Heat Flow
- Using Internal Ground and Voltage Planes to Spread Heat
- Simple Methods for Adding Circuit Board Heat Sinks
- Improving Thermal Conductivity of Potting Materials
- Evaluating Thermal Resistance Across Bolted Interfaces
- Effects of Surface Finish, Hardness and Pressure on Interface Resistance
- Effects of Altitude on Interface Resistance
- Thermal Resistance Across Different Board Edge Guides
- Thermal and Vibration Problems with Wedge Clamp Guides
- Simple Analog Thermal Resistor Networks for Complex Problems
- Tracing a Heat Conduction Path from Heat Source To Sink
- Mounting High Power Components on Circuit Boards
- Many Sample Problems to Promote Better Understanding
Practical Design And Analysis Guidelines
- How to Avoid Common Heat Pipe problems
- Various Liquids for Improved Cooling
- Chimney Equations for Improved Cooling of Large Cabinets
- Series-Parallel Air Flow Networks
- Humidity and Moisture Effects
- Effects of Various Types Of Conformal Coatings
- Environmental Stress Screening Guidelines
- Thermal Expansion Equilibrium Equations, Lead Wires, Solder
- Slow Thermal Cycling Solder Creep Forces, Stresses, Fatigue Life
- Case Histories to Promote Improved Electronic Design