COOLING TECHNIQUES FOR ELECTRONIC EQUIPMENT

by Prof. Dave Steinberg, P.E.

The purpose of this course is to show designers and engineers quick methods for designing electronic equipment to withstand severe thermal environments without failing. Techniques are presented which will permit the evaluation and design of cost effective, compact cooling systems, without the aid of a large digital computer.

Don't wait until your electronic equipment over-heats or fails because of poor cooling. Find out if your present systems are adequately cooled, how to avoid many common cooling problems and how to design efficient, reliable cooling systems for many different types of electronic cabinets.

The purpose of this course is to show designers and engineers quick methods for designing electronic equipment to withstand severe thermal environments without failing. Techniques are presented which will permit the evaluation and design of cost effective, compact cooling systems, without the aid of a large digital computer.

Learn simple design rules, and guidelines, which can improve the effective cooling of your sophisticated electronic components used in today's military, industrial and commercial electronic systems. Examine real hardware samples, which demonstrate the state-of-the-art techniques for packaging modern electronic equipment.

Learn methods for determining thermal stresses in lead wires and solder joints due to a mismatch in thermal expansions.

This course is based upon the popular cooling seminars Mr. Steinberg has been presenting overseas, at many private companies, and at the University of Wisconsin -Extension for the past ten years.

Questions are encouraged during the course, to make sure each participant understands the design techniques and applications presented.

WHO SHOULD ATTEND
Designers, engineers and managers from all the following functions:
R&D Electronic Engineers & Managers
Packaging Engineers
Quality & Reliability Engineers
Test Engineers
Manufacturing Engineers
Application & Sale Engineers

WHAT YOU WILL LEARN
How To Avoid Many Common Cooling Problems
How To Check If Your Present Electronic Systems Are Adequately Cooled
Quick Methods For Designing To Withstand Severe Thermal Environments
How To Tell The Difference Between Vibration Induced Failures And Thermally Induced Failures
The State-of-the-Art Techniques For Packaging Modern Electronic Equipment, From Real Hardware Examples

Click here for a complete, printable, class description.

Click here to access Mr. Steinberg's other classes:

Preventing Thermal Cycling & Vibr. Failures in Electronic Equipment

Preventing Vibration & Shock Failures in Electronic Equipment