COOLING TECHNIQUES FOR ELECTRONIC EQUIPMENT

by Steve Carlson

The purpose of this course is to show designers and engineers quick methods for designing electronic equipment to withstand severe thermal environments without failing. Techniques are presented which will permit the evaluation and design of cost effective, compact cooling systems, without the aid of a large digital computer.

Don't wait until your electronic equipment over-heats or fails because of poor cooling. Find out if your present systems are adequately cooled, how to avoid many common cooling problems and how to design efficient, reliable cooling systems for many different types of electronic cabinets.

The purpose of this course is to show designers and engineers quick methods for designing electronic equipment to withstand severe thermal environments without failing. Techniques are presented which will permit the evaluation and design of cost effective, compact cooling systems, without the aid of a large digital computer.

Learn simple design rules, and guidelines, which can improve the effective cooling of your sophisticated electronic components used in today's military, industrial and commercial electronic systems. Examine real hardware samples, which demonstrate the state-of-the-art techniques for packaging modern electronic equipment.

Learn methods for determining thermal stresses in lead wires and solder joints due to a mismatch in thermal expansions.

This course is based upon the popular cooling seminars Mr. Steinberg has been presenting overseas, at many private companies, and at the University of Wisconsin -Extension for the past ten years.

Questions are encouraged during the course, to make sure each participant understands the design techniques and applications presented.
NEW SEMINARS AND WEBINARS
Length Course Title Instructor
1 day 17. Ensuring Reliability in Lean Product Development John Paschkewitz
1 day 18. Advancing HALT & HASS:
Moving to Comparative Limit Anaylsis		 Kirk Gray
3 hours 19. How to Effectively Implement DFR & DFSS
in a Systems Engineering Environment		 Thimmiah Gurunatha, Peng.
3 hours 20. Thunder & Lightning Accelerated Testing
in a Systems Engineering Environment		 Thimmiah Gurunatha, Peng.
3 hours Gage R & R or Measuring Systems Analysis Thimmiah Gurunatha, Peng.
3 hours Rainbow SPC Thimmiah Gurunatha, Peng.
3 hours Improving Test Effect. and Effic. using Orthogonal Arrays Thimmiah Gurunatha, Peng.
3 hours Design for Six Sigma Tools to Promote the Development of World Class Product Requirements Sam Keene
3 hours 21. Quickest Way to Reliability is to
HALT and go FISHing		 Howard Cooper, DFSS BB, DFR
2 hours 22. Understanding Shock and Vibration Alec Feinberg, Ph.D.
3 hours Physics of Failure Methods for Building-in Reliability into Products Abhijit Dasgupta, Ph.D.
3 hours 24. Intro to Design for Manufacturability Aldo Fucinari
3 hours 25. Microelectronic Pkg Issues and Failure Analysis Tom Green
CLASSES ON RELIABILITY
Length Course Title Instructor
2 days 1. Introduction to Reliability & Weibull Analysis Chet Haibel, M.S.E.E.
2 days 2. HALT & HASS + Workshop Kirk Gray
2 days 2. HALT & HASS + Workshop Chet Haibel
2 days 2a. Mastering HALT & HASS Kirk Gray
2 days 2a. Mastering HALT & HASS Chet Haibel
2 days 4. Demonstrating Reliability Chet Haibel
4 days 6. Accelerated Test Data Analysis Wayne Nelson, Ph.D.
SPECIFIC TECHNICAL CLASSES
Length Course Title Instructor
2 days 7. Physics of Failure Abhijit Dasgupta, Ph.D.
2 days 8. Lead-Free Solder Joint Reliability Jean-Paul Clech, Ph.D.
1 day 9. Medical Device Risk Management Chet Haibel, M.S.E.E.
2 days 14. Cooling Techniques for Electronic Equipment Steve Carlson
2 days 15. Preventing Shock and Vibration Failures Steve Carlson
2 days 16. Preventing Thermal & Vibration Failures Steve Carlson
CUSTOM SEMINARS OFFERED
Length Course Title Instructor
1 day 12. Integrating Adv. Quality, Reliability, Durability
(QRD) Tactics with Accelerated Product Dev.		 James G. McLeish, M.S.
3 days 13. HALT & HASS and Classical Rel. Methods Integrated Chet Haibel, M.S.E.E.


WHO SHOULD ATTEND
Designers, engineers and managers from all the following functions:
R&D Electronic Engineers & Managers
Packaging Engineers
Quality & Reliability Engineers
Test Engineers
Manufacturing Engineers
Application & Sale Engineers

WHAT YOU WILL LEARN
How To Avoid Many Common Cooling Problems
How To Check If Your Present Electronic Systems Are Adequately Cooled
Quick Methods For Designing To Withstand Severe Thermal Environments
How To Tell The Difference Between Vibration Induced Failures And Thermally Induced Failures
The State-of-the-Art Techniques For Packaging Modern Electronic Equipment, From Real Hardware Examples

Click here for a complete, printable, class description.

Click here to access Mr. Carlson's other classes:

Preventing Thermal Cycling & Vibr. Failures in Electronic Equipment

Preventing Vibration & Shock Failures in Electronic Equipment
CLASS REGISTRATION
Check Mailed
Payment at Seminar
Visa or Mastercard
(for your security, please fax or phone your credit card information after registering)

Seminars fees for North America:
1 day - $695;
2 days - $1195; 3 days - $1595.
Please contact Hobbs Engineering for Webinar pricing.
Click here for the long Registration Form
Contacts:
Hobbs Engineering Corp.
4300 West 100th Ave,
Westminster, CO 80031
Tel: 303-465-5988
Fax: 303-469-4353
learn@hobbsengr.com

©2011 Hobbs Engineering Corp.